Form：KLA-Tencor 2017/9/18Browse：4566

KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.

Form：Semtech 2017/9/8Browse：4884

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance analog and mixed-signal semiconductors products and advanced algorithms, today announced that Chipsafer, a startup that specializes in providing Internet of Things (IoT) services for livestock management, uses Semtech's LoRa® devices and wireless RF technology (LoRa technology) to develop its ranch solution platform. Chipsafer's sensors forward sensor data from livestock, including body movements, local humidity, temperature and location, using LoRaWAN-based gateways and LoRaWANTM protocols.

Form：Tektronix 2017/9/8Browse：4254

How to ensure the availability and quality of instant and archival content will be a key challenge for video content distributors with variable bit rate (ABR) and network delivery (OTT) delivery models. Tektronix is the industry leader in video test and monitoring solutions, today introduced a full range of on-demand video (VOD) and instant OTT monitoring solutions, a leading video test, monitoring and diagnostic solution innovator, Industry and other video content distributors use cloud, virtual or physical networking to ensure high quality content.

Form：FLIRSystems,Inc. 2017/9/6Browse：3966

Recently, FLIR, a global leader in infrared thermal imaging, has introduced a new intelligent I / O solution specifically designed for FLIR infrared cameras to enable FLIR customers to integrate FLIR AX8, A310 and FCR thermal imagers with MIO to create a complete robust system for condition monitoring, early fire detection and process monitoring.

Form：Keyssa 2017/9/6Browse：3817

Keyssa, a leader in contactless connectivity solutions, today introduced the KSS104M, a new generation of component connector products, in an ultra-compact 3 x 3mm package with improved electrical and mechanical tolerances for easier design, significantly reduced power consumption and support High-speed communication protocol for industry standards. Keyssa also publishes KSS104M-CW (Connected World), which is a ready-to-use non-contact connection module that includes all the electromagnetic and mechanical requirements of critical systems, enabling the KSS104M to be built into mobile devices and other system products.

Form：u-blox 2017/9/6Browse：3849

The rise of networked car applications has subverted the traditional imagination of the car - through the combination of sensors, positioning, cellular and short-range communications technology, exciting new V2X architecture, opened an unprecedented new generation of automotive awareness.

Form：National Instruments 2017/9/6Browse：3632

NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.

Form：ACE Solution 2017/9/4Browse：3650

With the introduction of the TeraView TeraPulse 4000 time-domain spectrometer, the 780 nm femtosecond fiber laser and special patented photoconductive switches produce a terahertz wave with a frequency range of 0.06 to 4.5THz (1THz = 1000 GHz), a wide and stable terahertz wave is sufficient to provide a variety of material analysis and imaging studies.

Form：Hua Hong Semiconductor 2017/9/4Browse：4442

("Hua Hong Semiconductor" or "Company", together with its subsidiaries, collectively the "Group", stock code: 1347.HK) announced today that the Company's announcement of the Company's Microcontroller Unit (MCU) market, the latest launch of 95 nm single insulated gate non-volatile embedded memory (95 nm 5V SG eNVM) process platform. In ensuring the stability of the product at the same time, 95 nm 5V SG eVM process platform for its low power consumption, low cost advantage, widely favored by customers. The platform has been successfully mass production, product performance.

Form：LEM Electronics 2017/9/4Browse：4385

Power market leader in the field of sensors and high-quality power measurement solutions provider LME Electronics recently debut in Shanghai opened the ninth session of the Shanghai International Charging Station (Pile) Technology and Equipment Exhibition, the exhibition site to show its low-power charger , High-power charger and battery detection field of leading-edge technology, with nearly 200 customers to exchange demand and details Lyme Electronics latest solutions, with action to promote the charging infrastructure.