Form：New electronics 2018/1/2Browse：5293
Attacking DRAM market opportunities, Samsung Electronics announced the mass production of its second generation of 10 nanometer level (1y-nm) 8Gb DDR4 DRAM. The unit uses a high-sensitivity Cell Data Sensing System and an Air Spacer solution for higher performance, lower power consumption, and smaller footprint.
Form：Southern Metropolis Daily 2018/1/2Browse：4617
Yesterday, Baoneng New Energy Vehicle Co., Ltd., Guangdong Cores Chip Project and IC Industrial Innovation Park of Guangzhou Development Zone and the Southern Hospital of Knowledge City started construction in Zhongxin Knowledge City. Guangzhou Municipal Committee Ren Xuefeng, deputy secretary of municipal Party committee, mayor Wen Guohui, municipal CPPCC Chairman Liu Yuelun respectively with the Group Chairman Yao Zhenhua, Guangzhou Jin Yu Industrial Investment Group Chairman Li Yongxi, Guangzhou Yuecun Semiconductor Technology Co., Chip and the first batch of contracted 15 project leaders (including 9 chip design projects, 1 design and test service platform, 3 package test items, 1 material project, 1 industrial fund) who settled in IC Development Park of Guangzhou Development Zone Project), Southern Medical University Party Secretary Chen Minsheng, Nanfang Hospital Dean Li Wenyuan, Southern Hospital Party Secretary Zhu Hong discussion. City leaders Chen Zhiying, Zhou Yawei, Pan Jianguo, dawn to participate.
Form：Hua Hong Semiconductor 2017/12/27Browse：4486
Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.
Form： 2017/12/25Browse：4777
This week, according to the Yonhap news agency, Samsung Electronics announced that it has started using the second-generation 10nm process to produce 8Gb DDR4 particles, another iteration of technology after two years of the first-generation 10nm process.
Form：360doc 2017/12/25Browse：4160
DRAM market conditions will be different next year, DRAM market will continue to be tight, NAND Flash market will be in the first half of next year into oversupply.
Form：360doc 2017/12/19Browse：3694
iPhone X to give up fingerprinting Face ID gradually gaining market acceptance, so that non-Apple camp phone factory also accelerated layout, according to vendor vendors revealed that Huawei, OPPO, millet and other brand manufacturers have embraced 3D sensor technology. It is foreseeable that with the 3D sensing technology market continues to open, 2018 will launch a new machine with 3D sensor capabilities will spring up, the fingerprint recognition application under the screen may face crowding-out effect.
Form：MediaTek.Inc 2017/12/19Browse：4710
MediaTek has been aggressively pursuing the 5G market. Together with ITRI, it has developed LWA (LTE / Wi-Fi Link Aggregation) technology to improve network transmission bandwidth and 38/39 GHz millimeter-wave high-band access technology , And MUST (Multi-User Superposition Transmission) technology that supports the transmission capacity of small base stations. It has made headway and business opportunities for Taiwan to enter the global 5G communications market and is moving towards the goal of 5G network commercialization by 2020.
Form：NVIDIA 2017/9/22Browse：6126
NVIDIA today announced the release of the 17.7 Edition PGI 2017 Compiler and Tools to help high-performance computing systems developers develop higher-performing software for systems equipped with multi-core CPUs and heterogeneous GPU accelerators, while dramatically simplifying program design Process.
Form：Tektronix 2017/9/22Browse：5358
Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.
Form：Western Digital (WD) 2017/9/19Browse：4746
SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.
