Form：laoyaoba.com 2018/7/23Browse：5320

At the end of May this year, Qualcomm issued a brand new 700 series of the first model of the Valon 710, which is located between the flagship and the mainstream of the main Valon 600, drawing on many of the advanced features of the former. The cost has been well controlled, so it is very suitable for the middle and high-end models. Now less than two months ago, Xiaolong 720's name has appeared again!

Form：laoyaoba.com 2018/7/20Browse：4114

From the current signs, the Intel eight generation of core 12 threads for the first time in the mainstream desktop market 6 core 12 threads, immediately will be upgraded to the 8 core 16 threads, to catch up with the AMD Ryzen sharp dragon series, but AMD can not wait for death.

Form：laoyaoba.com 2018/7/20Browse：6429

In the high end, the Qualcomm Corp has almost "monopolized" the SoC market. Although apple, Samsung and even HUAWEI have high-end embedded processors, most of them supply their own products, rarely supply other mobile phone brands, and the capacity for mass production is also mainly high Qualcomm. But in the middle and low end, the MediaTek is still tenacious and has formed a certain competition with Qualcomm.

Form：laoyaoba.com 2018/7/20Browse：4341

19, the world's largest chip maker Taiwan integrated circuit manufacturing Limited by Share Ltd (hereinafter referred to as "TSI") held a conference release of the second quarter of this year's company operation. TSMC CFO and spokesman He Limei said at the conference that TSMC had no plans to list in mainland China.

Form：laoyaoba.com 2018/7/19Browse：3182

In recent years, NOKIA (Nokia) has actively developed various 5G related applications and also actively participates in the standard formulation to help the development of 5G connection technology in the application field of intelligent ports, car networking, intelligent factories and so on. To this end, NOKIA has introduced its own chipset to achieve the miniaturization of base stations and reduce the cost of 5G construction.

Form：laoyaoba.com 2018/7/19Browse：4054

Hygon, a continental chip manufacturer, has recently developed a Dhyana x86 efficient server chip developed based on Zen architecture authorization. The shock industry was shocked mainly by two factors, one of which was the mainland chipmaker's past MIPS and x86 central processor (CPU), which had only a poor production efficiency, and the other was the x86 central processor (CPU). It is a way to create another way to impact Intel (Intel) data center chip business through the technology authorization and joint venture mode with the sea light, but it can also be seen in the high-end x86 chip market, which is only the Intel and the super monopoly.

Form：laoyaoba.com 2018/7/19Browse：3916

Since this year, the personnel of the chip industry have been vibrant. On Tuesday, the American semiconductor giant TI CEO Brian Krace (BrianCrutcher) suddenly announced his departure, which was less than two months after he took office in June 1st. After the announcement, TI's share price was limited.

Form：laoyaoba.com 2018/7/18Browse：4293

Xilinx, Inc., (NASDAQ:XLNX), the global leader in adaptive and intelligent computing, announced today that it had completed the acquisition of Shenzhen Science and Technology (Inc.). Shen Jian Technology is a start-up in Beijing, with the industry's leading machine learning ability, focusing on neural network pruning, deep compression technology and system level optimization.

Form：laoyaoba.com 2018/7/18Browse：4462

Summary: TI said on Tuesday that Brian Crutcher resigned as president, CEO and TI board member. The board has appointed Rich Templeton as the new CEO, while Rich Templeton will continue to serve as the chairman of the board. In January of this year, TI had just announced that it would be a replacement, but within a short time, Rich Templeton returned to the old position.

Form：laoyaoba.com 2018/7/17Browse：4429

A thousand calls come out. The 3 iPhone chip supply chain, which will be launched in the second half of this year, has been fully launched last week, including a new generation of A12 application processors and 4G baseband chips, as well as other power management IC, Netcom and radio frequency IC, panel touch and drive IC and other related cores, all of which are expected to be in high volume, expected in September, according to the supply chain industry. A large number of deliveries can be delivered to the mobile assembly plant in the middle of the middle of the year.