Form：MoneyDJ 2018/10/19Browse：4058
According to the latest report issued by the Asian Department of Foreign Investment, the three major engines of the IC Design Factory will be ASIC, Internet of Things and 12-nanometer high-end smartphone chip combinations, which will maintain steady growth in the growth of mobile chips and non-mobile chips. It is better to hold the joint venture branch than the market rating, but the target price is reduced from 400 yuan (NT $350 to the same below) to $350.
Form：芯科技 2018/10/17Browse：4734
According to Nikko Industries, Japan's MLCC Major Factory, Murata, is planning to build a new factory in Okayama Prefecture at 10 billion yen ($89 million) after investing 40 billion yen to build a new plant in Shimane Prefecture late last month. The factory will be responsible for the production of ceramic materials for laminated ceramic capacitors, and Okayama and Shimane adjacent counties, may be set up for the raw materials of the Shimane plant.
Form：新浪美股 2018/10/12Browse：3032
On October 12, Beijing time, people familiar with the matter said that the U.S. authorities have begun to investigate whether the shares of Broadcom and CA Technologies have become targets of market manipulation plans.
Form：第一财经 2018/10/12Browse：3162
Semiconductor organizations in Guangzhou, Shenzhen, Zhuhai, Hong Kong and Macau have formally joined hands to form an alliance. In the future, they will build up a synergistic semiconductor industry ecosphere with Guangdong, Hong Kong and Macao.
Form：爱集微 2018/10/9Browse：3964
As supply of 12 inch silicon wafers continues to be tight, major wafer manufacturers around the world, including Japan's Shenggao, Germany's Silitronic and Universal Wafers, have begun to expand production plans. In contrast, the mainland is also accelerating the development of 12 inch large silicon wafers. According to the current planning of domestic enterprises, it is estimated that the domestic 12-inch silicon wafer production capacity will reach 1.45 million wafers per month by 2020, covering domestic demand.
Form：laoyaoba 2018/9/30Browse：4021
Today, Bob Swan, Intel's CFO and interim CEO, issued an open letter on Friday on the company's official website, in response to a series of recent capital market queries about Intel. However, this open letter can dispel the market's doubts, for Intel to bring long-term good, remains to be tested.
Form：laoyaoba 2018/9/30Browse：3636
Bloomberg recently reported that China's electronics giant TCL is weighing its remaining stake in Dutch semiconductor equipment manufacturer ASM International NV (ASMI) in its listed Asian subsidiary, which is facing pressure from radical investors.
Form：laoyaoba 2018/9/29Browse：4221
Leti, A Research Institute of ST and CEA Tech, announced a collaborative effort to develop silicon-based GaN power switching module manufacturing technology. The silicon-based GaN power technology will enable Italian Semiconductors to meet high-performance, high-power applications, including hybrid and electric vehicle chargers, wireless charging and servers.
Form： 2018/9/29Browse：4904
Chip giant Intel CFO and interim CEO Bob Swan released an open letter Friday on the company's official website "Supply Update" in response to recent capital market queries about Intel's chip supply capacity and 10 nm chip manufacturing process. The letter first reviewed the significant growth of the industry in the first half of this year. The explosive growth of data and the need to process, store, analyze, and share data have spurred industry innovation and an astonishing demand for cloud, network, and enterprise computing performance.
Form：集微网 2018/9/15Browse：3630
In a report at the end of August, Mosesmann, an analyst at Rosenblatt Securities Securities, said that the bottleneck for Intel's semiconductor manufacturing was not just a 10-nanonode delay, but a lot of time to solve the problem, because it would create a five-year, six-year, and six-year process disadvantage for Intel. Even seven years.
